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Radius Grinding M/C

Model : RG 20

Semi automatic radius grinding machine for laser diamond segment is designed to perform precise inner diameter grinding working with a peripheral grinding wheel, the oscillation movement of which is adjustable on both the oscillation radius and the translation speed. The operation is the combination of linear movement of the clamping devices with the swinging of the grinding wheel pivot.

Radius Grinding M/C



Main Features

  • Dry grinding with built-in aspirator
  • Automatic working by electronic way
  • Segment carrying trolley moves automatically
  • Longitudinal movement is adjustable
Technical Data
Model No. RG 20
Power Supply 220/380Volt,3 Phases, 50/60 Hz
Max. power consumption 2.5KW
Wheel rotation speed 2,500 RPM
Wheel dimension Dia. 150-200mm, Thickness 20mm
Segment carry trolley dimension 7.5-75mm Width 20, 24, 33, 40mm
Overall dimension (W)1,200mm x (L)1,000mm x (H)1,600mm
Weight Approx. 420Kg
 
Note : This Technical data may be used for guideline of production. DIEX Corp. will reserve the right to introduce any technical modification to its own machines, also in contract acquired, which is irrevocable decision are improvement, therefore, any datum given on the catalogue & data sheet has only indicative value.



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Head Office & Factory: 58-40, Chungchun 1-Dong,
Bupyung-Ku, Incheon City, Korea.
Tel: +82 32 501 - 8711
Fax: +82 32 501 - 8716
Email: diex@korea.com / diex@kotis.net / diex@hananet.net